Organic Solderability Preservative (OSP)
 Provides a surface planarity equivalent to the plated copper finish and that will not stain on gold surfaces.- Highly reliable process and consistently provide the excellent solder-joint strength of electronic assemblies.
| Product Name |
Application |
OSP-116 Make-up
OSP-116 Concentrate
OSP-116 Additive |
Organic solderability preservative |
|